The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Jul. 29, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Mengmeng Wang, Hefei, CN;

Hsin-Pin Huang, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01);
Abstract

Disclosed are an integrated circuit device and a formation method thereof. The formation method of an integrated circuit device comprises the following steps: providing a substrate, wherein a first plug and a second plug are disposed inside the substrate; forming a first covering layer covering the substrate; forming, in the first region, a first opening exposing the first plug; forming a first conductive layer in the first opening; forming an isolation layer covering the first conductive layer and the first covering layer; forming, in the first region, a contact hole exposing the first conductive layer and a trench located above the contact hole and connecting with the contact hole, and forming, in the second region, a second opening exposing the second plug; and forming a conductive connection layer in the contact hole, forming a second conductive layer in the trench, and forming a fuse wire in the second opening.


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