The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Sep. 01, 2021
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Jia-Chuan You, Taoyuan, TW;
Chia-Hao Chang, Hsinchu, TW;
Wai-Yi Lien, Hsinchu, TW;
Yu-Ming Lin, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A device includes a substrate, a first metal feature over the substrate, first and second spacers, a first dielectric layer, and a second metal feature. The first and second spacers are on opposite sidewalls of the conductive feature, respectively. The first dielectric layer is in contact with the first spacer, in which a top surface of the protection layer is higher than a top surface of the first spacer. The second metal feature is electrically connected to the first metal structure and in contact with a top surface and a sidewall of the protection layer.