The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Feb. 15, 2021
Applicant:

Globalfoundries U.s. Inc., Santa Clara, CA (US);

Inventors:

Wieland Pethe, Dresden, DE;

Dirk Noack, Dresden, DE;

Assignee:

GlobalFoundries U.S. Inc., Malta, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 21/68785 (2013.01);
Abstract

The embodiments herein relate to methods for processing a wafer through a semiconductor wafer processing system and an apparatus. According to an aspect of the present disclosure, a system for processing a semiconductor wafer is provided. The system includes a heating system, a pressure control system, and a gas flow system. The heating system is configured for heating a chuck. The pressure control system is configured for setting an internal chamber pressure. The gas flow system is configured for inflowing a gas in the process chamber to increase the internal chamber pressure to at least a base pressure. The heating system heats the chuck after the internal chamber pressure reaches the base pressure set by the pressure control system.


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