The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Sep. 24, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jingyun Zhang, Albany, NY (US);

Takashi Ando, Tuckahoe, NY (US);

Choonghyun Lee, Rensselaer, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/311 (2006.01); H01L 21/3115 (2006.01); H01L 21/8238 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0922 (2013.01); H01L 21/02532 (2013.01); H01L 21/02603 (2013.01); H01L 21/28088 (2013.01); H01L 21/28158 (2013.01); H01L 21/3115 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/823807 (2013.01); H01L 21/823842 (2013.01); H01L 21/823857 (2013.01); H01L 29/0673 (2013.01); H01L 29/408 (2013.01); H01L 29/42392 (2013.01); H01L 29/4908 (2013.01); H01L 29/66545 (2013.01); H01L 29/78618 (2013.01); H01L 29/78696 (2013.01); H01L 2029/42388 (2013.01);
Abstract

A method for forming a semiconductor device structure includes removing a portion of a first dielectric layer surrounding each of a plurality of channel layers of at least a first nanosheet stack. A portion of a second dielectric layer surrounding each of a plurality of channel layers of at least a second nanosheet stack is crystallized. A dipole layer is formed on the etched first dielectric layer and the crystallized portion of the second dielectric layer. The dipole layer is diffused into the etched first dielectric layer. The crystallized portion of the second dielectric layer prevents the dipole layer form diffusing into the second dielectric layer.


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