The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Sep. 15, 2021
Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;
Yenheng Chen, Jiangyin, CN;
Chengchung Lin, Jiangyin, CN;
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, Jiangyin, CN;
Abstract
The present disclosure provides a fan-out packaging structure and a method of fabricating the same. The fan-out packaging structure includes a redistribution layer, a passivation layer, a semiconductor chip, a first packaging layer, a groove, first metal bumps, second metal bumps, an adapter board, a stacked chip package, a passive element, and a filling layer. By means of the present disclosure, various chips performing different functions can be integrated into one packaging structure, thereby improving the integration level of the fan-out packaging structure. By means of the redistribution layer, the adapter board, and the first and second metal bumps, a three-dimensional vertically stacked packaging is achieved. As the result, in addition to improved integration level, the conduction paths in the packaging structure can be effectively shortened, thereby reducing power consumption, increasing the transmission speed, and increasing the data processing capacity.