The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Jun. 01, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/06 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/18 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1433 (2013.01);
Abstract
A semiconductor package includes a first chip, a first chip and a molding compound. The first chip has a first via protruding from the first chip. The second chip has a second via protruding from the second chip, wherein a thickness of the first chip is different from a thickness of the second chip. The molding compound encapsulates the first chip, the second chip, the first via and the second via, wherein surfaces of the first via, the second via and the molding compound are substantially coplanar.