The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Dec. 23, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Yung-Yao Lee, Hsinchu County, TW;
Wen-Chih Wang, New Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); G03F 1/38 (2012.01); G03F 7/095 (2006.01); G03F 1/70 (2012.01); H01L 21/033 (2006.01); H04B 10/43 (2013.01); H01L 31/12 (2006.01); G02B 6/42 (2006.01); H01L 21/768 (2006.01); G03F 7/20 (2006.01); G01N 21/956 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0273 (2013.01); G02B 6/4204 (2013.01); G03F 1/38 (2013.01); G03F 1/70 (2013.01); G03F 7/095 (2013.01); G03F 7/70033 (2013.01); G03F 7/70716 (2013.01); H01L 21/0274 (2013.01); H01L 21/0332 (2013.01); H01L 21/76816 (2013.01); H01L 31/125 (2013.01); H04B 10/43 (2013.01); G01N 2021/95676 (2013.01);
Abstract
The present disclosure provides an apparatus for manufacturing a semiconductor structure. The apparatus includes a stage, an optical transceiver over the stage, configured to obtain a first profile of a first surface of a substrate, an acoustic transceiver over the stage, configured to obtain a second profile of a top surface of a photo-sensitive layer over the substrate, wherein the stage is adapted to be displaced based on the first profile and the second profile.