The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Apr. 01, 2021
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Inventor:

Xiang Hu, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/6681 (2013.01); H01L 21/823431 (2013.01); H01L 29/7851 (2013.01);
Abstract

A semiconductor structure and a method for forming the semiconductor structure are provided. The semiconductor structure includes a substrate, and a first dielectric layer, a first gate structure and a plurality of second gate structures over the substrate. A second protection layer is formed on a top of a second gate structure. A first source-drain doped layer is formed between the first gate structure and an adjacent second gate structure. The first dielectric layer covers sidewalls of the first and second gate structures, and exposes a top surface of the second protection layer. The semiconductor structure also includes a first conductive structure in the first dielectric layer over the first source-drain doped layer, and a conductive layer on the first gate structure and the first conductive structure. A top surface of the conductive layer is coplanar with a top surface of the first dielectric layer.


Find Patent Forward Citations

Hu, Xiang. (2023). Semiconductor structure and fabrication method thereof (U.S. Patent No. 11749745). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11749745

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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