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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11749522 B1

PDFFull Text
Date of Patent:
Sep. 05, 2023

Filed:

Jan. 10, 2022

Composition for depositing silicon-containing thin film containing bis(aminosilyl)alkylamine compound and method for manufacturing silicon-containing thin using the same

Applicant:

Dnf Co., Ltd., Daejeon, KR;

Inventors:

Sung Gi Kim, Daejeon, KR;

Jeong Joo Park, Daejeon, KR;

Joong Jin Park, Daejeon, KR;

Se Jin Jang, Jeju-si, KR;

Byeong-Il Yang, Daejeon, KR;

Sang-Do Lee, Daejeon, KR;

Sam Dong Lee, Daejeon, KR;

Sang Ick Lee, Daejeon, KR;

Myong Woon Kim, Daejeon, KR;

Assignee:

DNF CO., LTD., Daejeon, KR;

Attorney:

McCoy Russell LLP

Primary Examiner:

Brook Kebede

Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/32 (2006.01); C01B 33/18 (2006.01); C01B 21/068 (2006.01); C07F 7/10 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/40 (2006.01); C23C 16/34 (2006.01); C23C 16/30 (2006.01); C23C 16/36 (2006.01); C09D 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02208 (2013.01); C01B 21/068 (2013.01); C01B 33/183 (2013.01); C07F 7/10 (2013.01); C09D 1/00 (2013.01); C23C 16/308 (2013.01); C23C 16/325 (2013.01); C23C 16/345 (2013.01); C23C 16/36 (2013.01); C23C 16/401 (2013.01); C23C 16/4554 (2013.01); C23C 16/50 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02126 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/02271 (2013.01); H01L 21/02274 (2013.01);
Abstract

Provided are a composition for depositing a silicon-containing thin film containing a bis(aminosilyl)alkylamine compound and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing the bis(aminosilyl)alkylamine compound capable of being usefully used as a precursor of the silicon-containing thin film, and a method for manufacturing a silicon-containing thin film using the same.

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