The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Jul. 09, 2021
Applicant:

Synopsys, Inc., Mountain View, CA (US);

Inventors:

Xi-Wei Lin, Fremont, CA (US);

Victor Moroz, Saratoga, CA (US);

Assignee:

Synopsys, Inc., Mountain View, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 21/822 (2006.01); H01L 29/08 (2006.01); H01L 27/06 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/775 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823814 (2013.01); H01L 21/8221 (2013.01); H01L 21/823807 (2013.01); H01L 21/823885 (2013.01); H01L 27/0688 (2013.01); H01L 27/092 (2013.01); H01L 29/0847 (2013.01); H01L 29/42392 (2013.01); H01L 29/0673 (2013.01); H01L 29/775 (2013.01);
Abstract

A method of performing epitaxial growth of a source and drain on levels of a complementary field effect transistor (CFET) is provided. The method includes depositing a first blocking material in a vertical channel of an unfinished CFET structure, oxidizing silicon at a surface of an upper level of the CFET to provide one or more SiOprotective layers, etching away a portion of silicon from a lower level of the CFET to form a lateral recess that is exposed to the vertical channel, and performing silicon epitaxial growth in the lower level of the unfinished CFET structure. Further, after the silicon epitaxial growth on the lower level, the method includes depositing a second blocking material in the vertical channel to cover at least a portion of the silicon epitaxial growth in the lower level, removing the SiOprotective layer, and performing epitaxial growth on the upper level.


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