The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Jul. 26, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chun Hsiung Tsai, Xinpu Township, TW;

Yan-Ting Lin, Baoshan Township, TW;

Clement Hsingjen Wann, Carmel, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/3115 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 27/092 (2006.01); H01L 29/36 (2006.01); H01L 29/78 (2006.01); H01L 21/8234 (2006.01); H01L 29/10 (2006.01); H01L 29/08 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/02164 (2013.01); H01L 21/02222 (2013.01); H01L 21/02271 (2013.01); H01L 21/02274 (2013.01); H01L 21/02318 (2013.01); H01L 21/02321 (2013.01); H01L 21/02326 (2013.01); H01L 21/02337 (2013.01); H01L 21/31155 (2013.01); H01L 21/76237 (2013.01); H01L 27/0924 (2013.01); H01L 27/1211 (2013.01); H01L 29/0649 (2013.01); H01L 29/36 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 21/02296 (2013.01); H01L 21/26513 (2013.01); H01L 21/823431 (2013.01); H01L 29/0847 (2013.01); H01L 29/1054 (2013.01); H01L 29/66803 (2013.01);
Abstract

The embodiments of mechanisms for doping wells of finFET devices described in this disclosure utilize depositing doped films to dope well regions. The mechanisms enable maintaining low dopant concentration in the channel regions next to the doped well regions. As a result, transistor performance can be greatly improved. The mechanisms involve depositing doped films prior to forming isolation structures for transistors. The dopants in the doped films are used to dope the well regions near fins. The isolation structures are filled with a flowable dielectric material, which is converted to silicon oxide with the usage of microwave anneal. The microwave anneal enables conversion of the flowable dielectric material to silicon oxide without causing dopant diffusion. Additional well implants may be performed to form deep wells. Microwave anneal(s) may be used to anneal defects in the substrate and fins.


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