The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Sep. 24, 2021
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Sanjay Dabral, Cupertino, CA (US);
Jun Zhai, Cupertino, CA (US);
Kwan-Yu Lai, Campbell, CA (US);
Kunzhong Hu, Cupertino, CA (US);
Vidhya Ramachandran, Cupertino, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 23/48 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/76897 (2013.01); H01L 21/78 (2013.01); H01L 22/32 (2013.01); H01L 23/481 (2013.01); H01L 23/60 (2013.01); H01L 24/96 (2013.01); H01L 25/50 (2013.01); H01L 2224/95001 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/30205 (2013.01);
Abstract
Stitched die packaging techniques and structures are described in which reconstituted chips are formed using wafer reconstitution and die-stitching techniques. In an embodiment, a chip includes a reconstituted chip-level back end of the line (BEOL) build-up structure to connect a die set embedded in an inorganic gap fill material.