The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Dec. 18, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Nobuyuki Takada, Tokyo, JP;

Hozumi Yasuda, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); B24B 37/20 (2012.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); B24B 37/20 (2013.01); H01L 21/30625 (2013.01); H01L 22/10 (2013.01);
Abstract

To improve uniformity in polishing of a polished surface of a substrate regardless of a tolerance of a diameter of the substrate. A substrate processing apparatus includes a table, a pad holder, a swing mechanism, a supporting memberA,B, a measuring instrument, and a driving mechanism. The tablesupports a substrate WF. The pad holderholds a polishing pad. The polishing padpolishes the substrate WF supported to the table. The swing mechanism swings the pad holder. The supporting memberA,B supports the polishing padswung to outside the tableby the swing mechanism. The measuring instrumentis configured to measure a diameter of the substrate WF. The driving mechanismadjusts a position of the supporting memberA,B with respect to the substrate WF supported to the tableaccording to the diameter of the substrate WF measured by the measuring instrument


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