The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Nov. 13, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kangguo Cheng, Schenectady, NY (US);

Bruce B. Doris, Brewster, NY (US);

Darsen D. Lu, Mount Kisco, NY (US);

Ali Khakifirooz, Los Altos, CA (US);

Kern Rim, Yorktown Heighls, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/311 (2006.01); H01L 21/308 (2006.01); H01L 21/306 (2006.01); H01L 21/324 (2006.01); H01L 29/10 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/762 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7846 (2013.01); H01L 21/02236 (2013.01); H01L 21/3086 (2013.01); H01L 21/30604 (2013.01); H01L 21/311 (2013.01); H01L 21/31051 (2013.01); H01L 21/31111 (2013.01); H01L 21/324 (2013.01); H01L 21/76224 (2013.01); H01L 29/0653 (2013.01); H01L 29/1054 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01); H01L 29/66553 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7851 (2013.01);
Abstract

A method of forming a fin structure that includes forming a plurality of fin structures from a bulk semiconductor substrate and forming a dielectric spacer on a sidewall of each fin structure in the plurality of fin structure. A semiconductor spacer is formed on a sidewall of the dielectric spacer. A dielectric fill is formed in the space between the adjacent fin structures. The semiconductor spacer and a portion of the fin structures that is present below a lower surface of the dielectric spacer are oxidized. Oxidizing a base portion of the fin structures produces a first strain and oxidizing the semiconductor spacer produces a second strain that is opposite the first strain.


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