The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Jun. 13, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chih-Fan Huang, Kaohsiung, TW;

Chih-Yang Pai, Hsinchu, TW;

Yuan-Yang Hsiao, Taipei, TW;

Tsung-Chieh Hsiao, Shetou Township, Changhua County, TW;

Hui-Chi Chen, Zhudong Township, Hsinchu County, TW;

Dian-Hau Chen, Hsinchu, TW;

Yen-Ming Chen, Chupei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01G 4/33 (2006.01); H01L 49/02 (2006.01); H01G 4/10 (2006.01); H01G 4/012 (2006.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01G 4/012 (2013.01); H01G 4/10 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01L 23/642 (2013.01); H01L 28/40 (2013.01); H01L 28/75 (2013.01);
Abstract

A metal-insulator-metal (MIM) capacitor structure and a method for forming the same are provided. The MIM capacitor structure includes a first electrode layer formed over a substrate, and a first spacer formed on a sidewall of the first electrode layer. The MIM capacitor structure also includes a first dielectric layer formed on the first spacers, and an end of the first dielectric layer is in direct contact with the first pacer.


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