The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Nov. 01, 2021
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Byung-Jin Choi, Austin, TX (US);

Seth J. Bamesberger, Austin, TX (US);

Alex Ruiz, Spicewood, TX (US);

Nilabh K. Roy, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/50 (2006.01); C23C 14/54 (2006.01);
U.S. Cl.
CPC ...
C23C 14/541 (2013.01); C23C 14/50 (2013.01); C23C 14/542 (2013.01);
Abstract

Techniques and mechanisms for cooling a substrate in a processing chamber by a bi-directional cooling process prior to transferring the substrate outside the processing chamber are provided. First cooling gas is introduced into the processing chamber from an upper gas source in a downward direction towards the upward facing surface of the substrate. An apparatus is placed underneath and in proximity to the substrate. Second cooling gas is introduced from the apparatus into the processing chamber in an upward direction towards the downward facing surface of the substrate. One or more gaps are cut out of the body portion of the apparatus, the gaps configured to allow the apparatus to avoid contact with the support structure holding the substrate, as the apparatus is moved in a horizontal direction into position underneath the substrate during placement of the body portion of the apparatus in proximity to the substrate.


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