The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Apr. 18, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chen-Hua Yu, Hsinchu, TW;
Sung-Feng Yeh, Taipei, TW;
Ming-Fa Chen, Taichung, TW;
Hsien-Wei Chen, Hsinchu, TW;
Hui-Wen Liu, Hsinchu, TW;
Ching-Pin Yuan, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 21/56 (2013.01); H01L 22/22 (2013.01); H01L 22/34 (2013.01); H01L 23/3121 (2013.01); H01L 23/544 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 2223/54426 (2013.01); H01L 2225/06517 (2013.01);
Abstract
In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.