The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Jul. 13, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xiaozhou Che, Sunnyvale, CA (US);

Graeme Jamieson Scott, Sunnyvale, CA (US);

Richard Gustav Hagborg, Felton, CA (US);

Alan H. Ouye, San Mateo, CA (US);

Nelson A. Yee, Redwood City, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 14/54 (2006.01); C23C 16/455 (2006.01); G01B 17/02 (2006.01); H01L 21/66 (2006.01); C23C 14/04 (2006.01); C23C 14/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); C23C 14/546 (2013.01); C23C 16/45565 (2013.01); G01B 17/025 (2013.01); H01L 21/6719 (2013.01); H01L 22/12 (2013.01); C23C 14/042 (2013.01); C23C 14/12 (2013.01);
Abstract

Methods and systems for monitoring film thickness using a sensor assembly include a process chamber having a chamber body, a substrate support disposed in the chamber body, a lid disposed over the chamber body, and a sensor assembly coupled to the chamber body at a lower portion of the sensor assembly. The sensor assembly is coupled to the lid at an upper portion of the sensor assembly. The sensor assembly includes one or more apertures disposed through one or more sides of the sensor assembly, and the one or more sensors are disposed in the sensor assembly through the one or more of the apertures.


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