The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

May. 18, 2021
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Milind S. Bhagavat, Broomfield, CO (US);

Rahul Agarwal, Santa Clara, CA (US);

Chia-Hao Cheng, Hsinchu, TW;

Assignee:

ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/566 (2013.01); H01L 23/3128 (2013.01); H01L 23/5227 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1427 (2013.01);
Abstract

Various semiconductor chip devices and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer (RDL) structure having a first plurality of conductor traces, a first molding layer on the first RDL structure, plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end, a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces, and wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.


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