The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Apr. 05, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Robert Douglas Cassel, Lehi, UT (US);

Sundaravadivel Rajarajan, South Jordan, UT (US);

Srivatsan Venkatesan, Sandy, UT (US);

Iniyan Soundappa Elango, Lehi, UT (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/00 (2006.01); G11C 13/00 (2006.01); H10B 63/00 (2023.01); H10N 70/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
G11C 13/0069 (2013.01); G11C 13/0004 (2013.01); G11C 13/004 (2013.01); G11C 13/0026 (2013.01); G11C 13/0028 (2013.01); G11C 13/0038 (2013.01); H10B 63/80 (2023.02); H10N 70/023 (2023.02); H10N 70/063 (2023.02); H10N 70/066 (2023.02); H10N 70/068 (2023.02); H10N 70/231 (2023.02); H10N 70/883 (2023.02);
Abstract

Systems, methods, and apparatus related to spike current suppression in a memory array. In one approach, a memory device includes a memory array having a cross-point memory architecture. The memory array has access lines (e.g., word lines and/or bit lines) configured to access memory cells of the memory array. Each access line has left and right portions. A conductive layer is positioned in the access line between the left and right portions. The conductive layer is formed in a socket that has been etched or otherwise formed in the access line to provide an opening. This opening is filled by the conductive layer. The conductive layer electrically connects the left and right portions of the access line to a via. A driver is electrically connected to the via for generating a voltage on the access line for accessing one or more memory cells. To reduce electrical discharge associated with current spikes, a first resistive film is formed in the access line between the left portion and the conductive layer, and a second resistive film is formed in the access line between the right portion and the conductive layer.


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