The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Oct. 20, 2020
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;

Inventors:

Bingliang Guo, Beijing, CN;

Huaichao Ma, Beijing, CN;

Andong Sun, Beijing, CN;

Henan Zhang, Beijing, CN;

Boyu Dong, Beijing, CN;

Lu Zhang, Beijing, CN;

Yujing Chen, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); H01L 21/02 (2006.01); C23C 14/54 (2006.01); C23C 14/06 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3464 (2013.01); C23C 14/3492 (2013.01); C23C 14/54 (2013.01); C23C 14/541 (2013.01); C23C 14/542 (2013.01); H01J 37/3447 (2013.01); H01J 37/3476 (2013.01); H01J 37/3485 (2013.01); H01J 37/3488 (2013.01); H01L 21/02266 (2013.01); C23C 14/0617 (2013.01);
Abstract

A sputtering method includes one or more sputtering processes. Each sputtering process includes in a first pre-sputtering phase, sputtering a target material on a baffle plate configured to shield a substrate; in a second pre-sputtering phase, sputtering a target material compound on the baffle plate; and in a main sputtering phase, sputtering the target material compound on the substrate. The first pre-sputtering phase is used to adjust a sputtering voltage for the main sputtering phase.


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