The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Aug. 28, 2018
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Ioana Sorina Barbu, Eindhoven, NL;

Murat Bozkurt, Uden, NL;

Maurits Van Der Schaar, Eindhoven, NL;

Alberto Da Costa Assafrao, Veldhoven, NL;

Assignee:

ASML NETHERLANDS B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/88 (2006.01); G03F 7/20 (2006.01); G01N 21/95 (2006.01); G01N 21/47 (2006.01); G01N 21/956 (2006.01); H01L 21/66 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G01N 21/8806 (2013.01); G01N 21/4788 (2013.01); G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G03F 7/705 (2013.01); G03F 7/7065 (2013.01); G03F 7/70525 (2013.01); G03F 7/70616 (2013.01); G03F 7/70633 (2013.01); H01L 22/12 (2013.01);
Abstract

Multilayered product structures are formed on substrates by a combination of patterning steps, physical processing steps and chemical processing steps. An inspection apparatus illuminates a plurality of target structures and captures pupil images representing the angular distribution of radiation scattered by each target structure. The target structures have the same design but are formed at different locations on a substrate and/or on different substrates. Based on a comparison of the images the inspection apparatus infers the presence of process-induced stack variations between the different locations. In one application, the inspection apparatus separately measures overlay performance of the manufacturing process based on dark-field images, combined with previously determined calibration information. The calibration is adjusted for each target, depending on the stack variations inferred from the pupil images.


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