The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Sep. 10, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Shinji Wakabayashi, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67742 (2013.01); H01L 21/67173 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H01L 21/67766 (2013.01); H01L 21/67775 (2013.01); H01L 21/681 (2013.01); H01L 21/6875 (2013.01); H01L 21/68707 (2013.01);
Abstract

In a vacuum processing apparatus, a load lock module includes a housing and substrate holding sections, the housing having first substrate transfer ports formed on one of right and left sides thereof and a second substrate transfer port formed on a rear side thereof, and each substrate holding section being configured to hold a substrate on a right or left side in the housing. Further, a normal pressure transfer chamber extends over or under the housing from one of the right and left sides of the housing to the other one thereof so that each first substrate transfer port is opened. The normal pressure transfer chamber includes a stacked transfer region that is a region overlapping the housing. Further, a normal pressure transfer mechanism transfers the substrate between each substrate holding section and a transfer container carried into each of loading/unloading ports via the stacked transfer region.


Find Patent Forward Citations

Wakabayashi, Shinji. (2023). Vacuum processing apparatus and substrate transfer method (U.S. Patent No. 11688619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11688619

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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