The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jan. 17, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Shao-Jyun Wu, New Taipei, TW;

Sheng-Liang Pan, Hsinchu, TW;

Huan-Just Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/8238 (2006.01); G03F 7/09 (2006.01); H01L 29/66 (2006.01); H01L 21/027 (2006.01); H01L 21/3213 (2006.01); H01L 27/092 (2006.01); H01L 29/08 (2006.01); H01L 29/49 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); H01L 21/32 (2006.01); H01L 21/30 (2006.01); H01L 21/3205 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28185 (2013.01); G03F 7/091 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); H01L 21/0234 (2013.01); H01L 21/0276 (2013.01); H01L 21/02252 (2013.01); H01L 21/28088 (2013.01); H01L 21/28158 (2013.01); H01L 21/28176 (2013.01); H01L 21/28211 (2013.01); H01L 21/30 (2013.01); H01L 21/32 (2013.01); H01L 21/324 (2013.01); H01L 21/3205 (2013.01); H01L 21/32136 (2013.01); H01L 21/32139 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 21/823842 (2013.01); H01L 27/0924 (2013.01); H01L 29/0847 (2013.01); H01L 29/4966 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method includes forming a first high-k dielectric layer over a first semiconductor region, forming a second high-k dielectric layer over a second semiconductor region, forming a first metal layer comprising a first portion over the first high-k dielectric layer and a second portion over the second high-k dielectric layer, forming an etching mask over the second portion of the first metal layer, and etching the first portion of the first metal layer. The etching mask protects the second portion of the first metal layer. The etching mask is ashed using meta stable plasma. A second metal layer is then formed over the first high-k dielectric layer.


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