The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Aug. 05, 2021
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
Inventors:
Yukihisa Wada, Kawasaki, JP;
Shinya Koga, Kawasaki, JP;
Kazuhiro Takahashi, Kawasaki, JP;
Natsumi Okawa, Kawasaki, JP;
Daijiro Mori, Kawasaki, JP;
Assignee:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/38 (2006.01); C23F 1/26 (2006.01); C23F 1/28 (2006.01); C09K 13/00 (2006.01); C09K 13/06 (2006.01); C09K 13/04 (2006.01); C23F 1/00 (2006.01); C23F 1/14 (2006.01); H01L 21/306 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
C23F 1/38 (2013.01); C09K 13/00 (2013.01); C09K 13/04 (2013.01); C09K 13/06 (2013.01); C23F 1/00 (2013.01); C23F 1/14 (2013.01); C23F 1/26 (2013.01); C23F 1/28 (2013.01); H01L 21/30604 (2013.01); H01L 21/4892 (2013.01);
Abstract
A method for manufacturing a ruthenium wiring including (i) treating a metal surface including ruthenium using a first chemical solution including a compound having a functional group capable of coordinating to a ruthenium atom, and (ii) carrying out an etching treatment on the metal surface including ruthenium treated with the first chemical solution, using a second chemical solution.