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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11682634 B1

PDFFull Text
Date of Patent:
Jun. 20, 2023

Filed:

Oct. 01, 2020

Packaged electronic circuits having moisture protection encapsulation and methods of forming same

Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Kyle Bothe, Cary, NC (US);

Dan Namishia, Wake Forest, NC (US);

Fabian Radulescu, Chapel Hill, NC (US);

Scott Sheppard, Chapel Hill, NC (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:

Myers Bigel, P.A.

Primary Examiner:

Bo B Jang

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/31 (2013.01); H01L 23/528 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2223/6683 (2013.01);
Abstract

A packaged electronic circuit includes a substrate having an upper surface, a first metal layer on the upper surface of the substrate, a first polymer layer on the first metal layer opposite the substrate, a second metal layer on the first polymer layer opposite the first metal layer, a dielectric layer on the first polymer layer and at least a portion of the second metal layer and a second polymer layer on the dielectric layer.

Find Patent Forward Citations

Bothe, Kyle. (2023). Packaged electronic circuits having moisture protection encapsulation and methods of forming same (U.S. Patent No. 11682634). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11682634

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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