The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Sep. 01, 2021
Applicant:

Zhuhai Access Semiconductor Co., Ltd, Guangdong, CN;

Inventors:

Xianming Chen, Guangdong, CN;

Lei Feng, Guangdong, CN;

Benxia Huang, Guangdong, CN;

Yejie Hong, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53228 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01);
Abstract

A connector for implementing multi-faceted interconnection according to an embodiment of the present disclosure includes a first dielectric layer between a first circuit layer and a second circuit layer, a first copper pillar layer connecting the first circuit layer and the second circuit layer in the first dielectric layer, a second dielectric layer on the first circuit layer, a third circuit layer on the second dielectric layer, and a vertical second copper pillar layer connected to the third circuit layer, wherein an opening is formed in the second dielectric layer to expose the first circuit layer, and the second copper pillar layer exposes side faces facing side end faces of the first dielectric layer and the second dielectric layer.


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