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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11682605 B1

PDFFull Text
Date of Patent:
Jun. 20, 2023

Filed:

May. 28, 2019

Integrated circuit packages with asymmetric adhesion material regions

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Karthik Visvanathan, Chandler, AZ (US);

Shenavia S. Howell, Chandler, AZ (US);

Sergio Antonio Chan Arguedas, Chandler, AZ (US);

Peng Li, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Akona IP

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/373 (2006.01); H05K 1/18 (2006.01); H01L 25/065 (2023.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 23/3736 (2013.01); H01L 23/5226 (2013.01); H01L 25/0655 (2013.01); H05K 1/18 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H05K 2201/10734 (2013.01);
Abstract

Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.

Find Patent Forward Citations

Visvanathan, Karthik. (2023). Integrated circuit packages with asymmetric adhesion material regions (U.S. Patent No. 11682605). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11682605

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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