The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Nov. 26, 2020
United Microelectronics Corporation, Hsinchu, TW;
Purakh Raj Verma, Singapore, SG;
Su Xing, Singapore, SG;
Shyam Parthasarathy, Singapore, SG;
Xiao Yuan Zhi, Singapore, SG;
UNITED MICROELECTRONICS CORPORATION, Hsinchu, TW;
Abstract
An inductor module and a method for fabricating the same are disclosed. The inductor module includes a substrate, a first inter-level dielectric layer, a plurality of second inter-level dielectric layers, a trench, and a first metal layer. The first inter-level dielectric layer is disposed on the substrate. The second inter-level dielectric layers are sequentially stacked on the first inter-level dielectric layer. The trench is disposed to penetrate at least two of the second inter-level dielectric layers. The first metal layer is disposed in the trench. The first metal layer has a top side surface and a bottom side surface opposite to each other. The top side surface is coplanar with an upper surface of the trench in the second inter-level dielectric layers. The bottom side surface is coplanar with a bottom surface of the trench in the second inter-level dielectric layers.