The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Jun. 14, 2022
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
David K. Hwang, Boise, ID (US);
John F. Kaeding, Boise, ID (US);
Richard J. Hill, Boise, ID (US);
Scott E. Sills, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/76 (2006.01); H01L 29/66 (2006.01); H01L 27/11509 (2017.01); H01L 27/108 (2006.01); H01L 29/16 (2006.01); H01L 29/26 (2006.01); H01L 29/786 (2006.01); H01L 21/02 (2006.01); H01L 27/11507 (2017.01);
U.S. Cl.
CPC ...
H01L 29/7606 (2013.01); H01L 21/02521 (2013.01); H01L 21/02527 (2013.01); H01L 21/02568 (2013.01); H01L 27/10808 (2013.01); H01L 27/10855 (2013.01); H01L 27/10873 (2013.01); H01L 27/10897 (2013.01); H01L 27/11507 (2013.01); H01L 27/11509 (2013.01); H01L 29/1606 (2013.01); H01L 29/26 (2013.01); H01L 29/66045 (2013.01); H01L 29/66969 (2013.01); H01L 29/78642 (2013.01); H01L 29/78696 (2013.01);
Abstract
Some embodiments include an integrated assembly having a conductive structure, an annular structure extending through the conductive structure, and an active-material-structure lining an interior periphery of the annular structure. The annular structure includes dielectric material. The active-material-structure includes two-dimensional-material. Some embodiments include methods of forming integrated assemblies.