The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Jan. 08, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Yung-Shun Hsu, Changhua County, TW;
Ching-Yu Chang, Tainan, TW;
Chiao-Kai Chang, Taichung, TW;
Wai Hong Cheah, Taichung, TW;
Chien-Fang Lin, Tainan, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/3065 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); H01J 37/32 (2013.01); H01J 37/32449 (2013.01); H01J 37/32733 (2013.01); H01L 21/3065 (2013.01); H01L 21/32136 (2013.01); H01L 21/67069 (2013.01); H01L 21/67126 (2013.01); H01L 21/67167 (2013.01); H01L 21/67201 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/334 (2013.01);
Abstract
The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.