The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Mar. 12, 2020
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Masanori Nakayama, Toyama, JP;

Katsunori Funaki, Toyama, JP;

Tatsushi Ueda, Toyama, JP;

Yasutoshi Tsubota, Toyama, JP;

Yuichiro Takeshima, Toyama, JP;

Hiroto Igawa, Toyama, JP;

Yuki Yamakado, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); H01L 21/768 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76886 (2013.01); H01L 21/321 (2013.01); H01L 21/67115 (2013.01); H01L 21/76862 (2013.01);
Abstract

There is provided a technique that includes: loading a substrate having a metal film composed of a single metal element formed on a surface of the substrate into a process chamber; generating reactive species by plasma-exciting a processing gas containing hydrogen and oxygen; and modifying the metal film by supplying the reactive species to the substrate, wherein in the act of modifying the metal film, the metal film is modified such that a crystal grain size of the metal element constituting the metal film is larger than that before performing the act of modifying the metal film.


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