The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Nov. 24, 2020
Applicant:

Ememory Technology Inc., Hsin-Chu, TW;

Inventors:

Tsung-Mu Lai, Hsinchu County, TW;

Wei-Chen Chang, Hsinchu County, TW;

Hsueh-Wei Chen, Hsinchu County, TW;

Assignee:

EMEMORY TECHNOLOGY INC., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); G06N 3/063 (2023.01); G06N 3/04 (2023.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
G06N 3/063 (2013.01); G06N 3/04 (2013.01); H01L 23/5226 (2013.01); H10B 20/20 (2023.02); H10B 63/30 (2023.02); H10N 70/041 (2023.02); H10N 70/8833 (2023.02);
Abstract

A resistive random-access memory cell includes a well region, a first doped region, a second doped region, a third doped region, a first gate structure, a second gate structure and a third gate structure. The first gate structure is formed over the surface of the well region between the first doped region and the second doped region. The second gate structure is formed over the second doped region. The third gate structure is formed over the surface of the well region between the second doped region and the third doped region. A first metal layer is connected with the first doped region and the third doped region. A second metal layer is connected with the conductive layer of the first gate structure and the conductive layer of the third gate structure.


Find Patent Forward Citations

Loading…