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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11662479 B1

PDFFull Text
Date of Patent:
May. 30, 2023

Filed:

May. 20, 2021

Methods and systems for printed circuit board design based on automatic corrections

Applicant:

Bruker Nano, Inc., Santa Barbara, CA (US);

Inventors:

David Lewis Adler, San Jose, CA (US);

Freddie Erich Babian, Palo Alto, CA (US);

Scott Joseph Jewler, San Jose, CA (US);

Assignee:

Bruker Nano, Inc., Santa Barbara, CA (US);

Attorney:

Boyle Fredrickson S.C.

Primary Examiner:

Suresh Memula

Int. Cl.
CPC ...
G01T 1/20 (2006.01); G06N 20/00 (2019.01); G06F 30/398 (2020.01); G01N 23/04 (2018.01); G01N 23/083 (2018.01); G01N 23/18 (2018.01); G06T 5/00 (2006.01); G06T 7/00 (2017.01); H01L 21/67 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); G06F 18/24 (2023.01); G06F 18/214 (2023.01); G06V 10/82 (2022.01); G06F 119/18 (2020.01); G06F 115/12 (2020.01);
U.S. Cl.
CPC ...
G01T 1/20 (2013.01); G01N 23/04 (2013.01); G01N 23/043 (2013.01); G01N 23/083 (2013.01); G01N 23/18 (2013.01); G06F 18/214 (2023.01); G06F 18/24 (2023.01); G06F 30/398 (2020.01); G06N 20/00 (2019.01); G06T 5/007 (2013.01); G06T 7/0012 (2013.01); G06T 7/0014 (2013.01); G06V 10/82 (2022.01); H01L 21/67288 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); G01N 2223/04 (2013.01); G01N 2223/401 (2013.01); G01N 2223/426 (2013.01); G01N 2223/505 (2013.01); G01N 2223/6466 (2013.01); G06F 2115/12 (2020.01); G06F 2119/18 (2020.01); G06T 2207/10081 (2013.01); G06T 2207/10116 (2013.01); G06T 2207/20024 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20208 (2013.01); G06T 2207/30004 (2013.01);
Abstract

In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

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