The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

May. 11, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Feras Eid, Chandler, AZ (US);

Sasha N. Oster, Marion, IA (US);

Telesphor Kamgaing, Chandler, AZ (US);

Georgios C. Dogiamis, Chandler, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01Q 19/22 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/241 (2013.01); H01Q 1/526 (2013.01); H01Q 19/22 (2013.01); H01L 23/3675 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01);
Abstract

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.


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