The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Oct. 04, 2020
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventor:
Bong Woong Mun, Singapore, SG;
Assignee:
GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/417 (2006.01); H01L 21/3065 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7816 (2013.01); H01L 21/3065 (2013.01); H01L 29/0653 (2013.01); H01L 29/0886 (2013.01); H01L 29/4175 (2013.01); H01L 29/66681 (2013.01);
Abstract
A semiconductor device is provided, which includes a multi-layered substrate, a first doped region, a second doped region, and a gate structure. The multi-layered substrate has a device layer over an isolation layer and the device layer includes a first region having a first substrate thickness and a second region having a second substrate thickness that is lesser than the first substrate thickness. The first doped region is in the first region and the second doped region is in the second region. The gate structure is between the first and second doped regions.