The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Sep. 25, 2020
Applicant:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Inventors:
Rahul Agarwal, Santa Clara, CA (US);
Milind S. Bhagavat, Broomfield, CO (US);
Assignee:
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 24/13 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24991 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/25174 (2013.01); H01L 2224/25177 (2013.01); H01L 2224/82801 (2013.01);
Abstract
A chip for hybrid bridged fanout chiplet connectivity, the chip comprising: a central chiplet; one or more first chiplets each coupled to the central chiplet using a plurality of fanout traces; and one or more second chiplets each coupled to the central chiplet using one or more interconnect dies (ICDs).
Agarwal, Rahul. (2023). Hybrid bridged fanout chiplet connectivity (U.S. Patent No. 11658123). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11658123
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile