The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Mar. 29, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kelly Lofgreen, Phoenix, AZ (US);
Chandra Mohan Jha, Chandler, AZ (US);
Krishna Vasanth Valavala, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/38 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2023.01); H10N 10/82 (2023.01); H10N 10/01 (2023.01);
U.S. Cl.
CPC ...
H01L 23/38 (2013.01); H01L 23/481 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/18 (2013.01); H10N 10/01 (2023.02); H10N 10/82 (2023.02); H01L 2924/1434 (2013.01);
Abstract
An IC package, comprising a first IC component comprising a first interconnect on a first surface thereof; a second IC component comprising a second interconnect on a second surface thereof. The second component is above the first component, and the second surface is opposite the first surface. A thermoelectric cooling (TEC) device is between the first surface and the second surface. The TEC device is electrically coupled to the first interconnect and to the second interconnect.