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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11651492 B1

PDFFull Text
Date of Patent:
May. 16, 2023

Filed:

Jul. 09, 2020

Methods and systems for manufacturing printed circuit board based on x-ray inspection

Applicant:

Bruker Nano, Inc., Santa Barbara, CA (US);

Inventors:

David Lewis Adler, San Jose, CA (US);

Scott Joseph Jewler, San Jose, CA (US);

Freddie Erich Babian, Palo Alto, CA (US);

Andrew George Reid, San Jose, CA (US);

Benjamin Thomas Adler, San Jose, CA (US);

Assignee:

Bruker Nano, Inc., Santa Barbara, CA (US);

Attorney:

Boyle Fredrickson S.C.

Primary Examiner:

David P Porta

Assistant Examiner:

Djura Malevic

Int. Cl.
CPC ...
G01N 23/04 (2018.01); G01T 1/20 (2006.01); G06T 7/00 (2017.01); G06N 20/00 (2019.01); G06F 30/398 (2020.01); G01N 23/083 (2018.01); G01N 23/18 (2018.01); G06K 9/62 (2022.01); G06T 5/00 (2006.01); H01L 21/67 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); G06F 119/18 (2020.01); G06F 115/12 (2020.01);
U.S. Cl.
CPC ...
G06T 7/0014 (2013.01); G01N 23/04 (2013.01); G01N 23/043 (2013.01); G01N 23/083 (2013.01); G01N 23/18 (2013.01); G01T 1/20 (2013.01); G06F 30/398 (2020.01); G06K 9/6256 (2013.01); G06K 9/6267 (2013.01); G06N 20/00 (2019.01); G06T 5/007 (2013.01); G06T 7/0012 (2013.01); H01L 21/67288 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); G01N 2223/04 (2013.01); G01N 2223/401 (2013.01); G01N 2223/426 (2013.01); G01N 2223/505 (2013.01); G01N 2223/6466 (2013.01); G06F 2115/12 (2020.01); G06F 2119/18 (2020.01); G06T 2207/10081 (2013.01); G06T 2207/10116 (2013.01); G06T 2207/20024 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20208 (2013.01); G06T 2207/30004 (2013.01);
Abstract

In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

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