The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

May. 17, 2021
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Inventors:

Shuaijie Chi, Shanghai, CN;

Haiyang Zhang, Shanghai, CN;

Ermin Chong, Shanghai, CN;

Wei Tian, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 29/0653 (2013.01); H01L 29/6681 (2013.01);
Abstract

Semiconductor structures and fabrication methods thereof are provided. The semiconductor includes a substrate; a gate structure on the substrate; and a dielectric layer on the substrate and covering sidewall surfaces of the gate structure. The dielectric layer includes an opening passing through the gate structure along a direction perpendicular to an extending direction of the gate structure. The semiconductor structure also includes a first isolation layer in the opening and with a top surface lower than a top surface of the gate structure.


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