The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2023

Filed:

Apr. 13, 2020
Applicant:

Innoscience (Zhuhai) Technology Co., Ltd., Zhuhai, CN;

Inventors:

Hao Li, Zhuhai, CN;

Anbang Zhang, Zhuhai, CN;

Jian Wang, Zhuhai, CN;

Haoning Zheng, Zhuhai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/205 (2006.01); H01L 29/207 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0642 (2013.01); H01L 29/0649 (2013.01); H01L 29/402 (2013.01); H01L 29/41775 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 29/205 (2013.01); H01L 29/207 (2013.01);
Abstract

The present disclosure provides a semiconductor device and a fabrication method thereof. The semiconductor device includes a first III-nitride layer, a second III-nitride layer, a first contact layer, a second contact layer, a structure, and a gate layer. The second III-nitride layer is in direct contact with the first III-nitride layer. The first contact layer and the second contact layer are disposed over the second III-nitride layer. The structure is adjacent to an interface of the first III-nitride layer and the second III-nitride layer, and a material of the structure is different from a material of the first III-nitride layer or a material of the second III-nitride layer. The gate layer is disposed between the first contact layer and the second contact layer.


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