The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Dec. 27, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Ravi Prakash Gutala, San Jose, CA (US);
Aravind Raghavendra Dasu, Milpitas, CA (US);
Sean R. Atsatt, Santa Cruz, CA (US);
Scott J. Weber, Piedmont, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 7/38 (2006.01); H03K 19/173 (2006.01); H03K 19/0175 (2006.01); G06F 3/06 (2006.01); G11C 11/417 (2006.01); H01L 25/18 (2023.01); H01L 27/02 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/367 (2006.01); G11C 7/10 (2006.01); H03K 19/17796 (2020.01); G11C 5/04 (2006.01); G06F 30/34 (2020.01);
U.S. Cl.
CPC ...
H03K 19/017581 (2013.01); G06F 3/0604 (2013.01); G06F 3/0632 (2013.01); G06F 3/0679 (2013.01); G11C 7/10 (2013.01); G11C 11/417 (2013.01); H01L 23/3675 (2013.01); H01L 23/481 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/0207 (2013.01); H03K 19/17796 (2013.01); G06F 30/34 (2020.01); G11C 5/04 (2013.01); H01L 23/367 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/8112 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1435 (2013.01); H01L 2924/14335 (2013.01);
Abstract
An integrated circuit device having separate dies for programmable logic fabric and circuitry to operate the programmable logic fabric are provided. A first integrated circuit die may include field programmable gate array fabric. A second integrated circuit die may be coupled to the first integrated circuit die. The second integrated circuit die may include fabric support circuitry that operates the field programmable gate array fabric of the first integrated circuit die.