The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Oct. 25, 2016
Applicant:

Acm Research (Shanghai) Inc., Shanghai, CN;

Inventors:

Hui Wang, Shanghai, CN;

Xi Wang, Shanghai, CN;

Cheng Cheng, Shanghai, CN;

Jun Wu, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 3/04 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B08B 3/04 (2013.01); H01L 21/02057 (2013.01);
Abstract

An apparatus and a method for wet process on a semiconductor substrate are provided. The apparatus includes a process chamber (), a chuck () for holding and positioning a semiconductor substrate () disposed in the process chamber, a rotating driving mechanism () driving the chuck to rotate, a chamber shroud () disposed surrounding the process chamber, at least one vertical driving mechanism driving the chamber shroud to move up or down, a shielding cover (), at least one driving device () driving the shielding cover to cover down or lift up, at least one dispenser module () having a dispenser () for spraying liquid to the surface of the semiconductor substrate. When the shielding cover covers above the process chamber, the chamber shroud is moved up to couple with the shielding cover, so as to seal the process chamber for preventing the liquid from splashing out of the process chamber.


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