logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11605674 B1

PDFFull Text
Date of Patent:
Mar. 14, 2023

Filed:

May. 29, 2021

Metal-insulator-semiconductor-insulator-metal (misim) device, method of operation, and memory device including the same

Applicants:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

National Taiwan University, Taipei, TW;

Inventors:

Jenn-Gwo Hwu, Taipei, TW;

Hao-Hsiung Lin, Taipei, TW;

Chang-Feng Yan, Taoyuan, TW;

Samuel C. Pan, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Thong Q Le

Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 27/26 (2006.01); G11C 11/34 (2006.01); H01L 47/02 (2006.01); G11C 11/56 (2006.01); H01L 29/417 (2006.01); G11C 13/00 (2006.01); H01L 29/88 (2006.01); H01L 27/105 (2023.01);
U.S. Cl.
CPC ...
H01L 27/265 (2013.01); G11C 11/34 (2013.01); G11C 11/56 (2013.01); G11C 13/0007 (2013.01); H01L 27/1052 (2013.01); H01L 29/417 (2013.01); H01L 29/88 (2013.01); H01L 47/02 (2013.01);
Abstract

A metal-insulator-semiconductor-insulator-metal (MISIM) device includes a semiconductor layer, an insulating layer disposed over an upper surface of the semiconductor layer, a back electrode disposed over a lower surface of the semiconductor layer opposing the upper surface, and first and second electrodes disposed over the insulating layer and spaced-apart from each other.

Find Patent Forward Citations

Hwu, Jenn-Gwo. (2023). Metal-insulator-semiconductor-insulator-metal (misim) device, method of operation, and memory device including the same (U.S. Patent No. 11605674). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11605674

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…