The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Jun. 09, 2021
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Alexander Kalnitsky, San Francisco, CA (US);
Harry-Hak-Lay Chuang, Hsinchu County, TW;
Sheng-Haung Huang, Hsinchu, TW;
Tien-Wei Chiang, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
The present disclosure provides a semiconductor structure. The semiconductor structure includes a substrate, a transistor region, a metal interconnect, and a magnetic tunneling junction (MTJ). The transistor region includes a gate over the substrate, and a doped region is at least partially in the substrate. The metal interconnect is over the doped region. The metal interconnect includes a metal via. The MTJ is entirely underneath the metal interconnect and between the doped region and the metal via, and a diameter of a bottom surface of the MTJ is greater than a diameter of an upper surface of the MTJ.