The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

May. 27, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xiangxin Rui, Campbell, CA (US);

Soo Young Choi, Fremont, CA (US);

Shinichi Kurita, San Jose, CA (US);

Yujia Zhai, Fremont, CA (US);

Lai Zhao, Campbell, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 49/02 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01); H01L 21/02 (2006.01); H01J 37/32 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); C23C 16/56 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1262 (2013.01); C23C 16/40 (2013.01); C23C 16/45544 (2013.01); C23C 16/50 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); H01J 37/32899 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02178 (2013.01); H01L 21/02181 (2013.01); H01L 21/02186 (2013.01); H01L 21/02189 (2013.01); H01L 21/02192 (2013.01); H01L 21/02274 (2013.01); H01L 21/02304 (2013.01); H01L 21/02318 (2013.01); H01L 21/67167 (2013.01); H01L 21/68742 (2013.01); H01L 27/124 (2013.01); H01L 27/1222 (2013.01); H01L 27/1248 (2013.01); H01L 27/1255 (2013.01); H01L 28/60 (2013.01); H01L 29/4908 (2013.01); H01L 29/78675 (2013.01); H01J 2237/332 (2013.01); H01L 27/3244 (2013.01); H01L 27/3262 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to a layer stack including a high K dielectric layer formed over a first dielectric layer and a metal electrode. The high K dielectric layer has a K value of 20 or higher and may be formed as a part of a capacitor, a gate insulating layer, or any suitable insulating layer in electronic devices, such as display devices. The layer stack includes a second dielectric layer disposed on the first dielectric layer and the metal layer, and the high K dielectric layer containing zirconium dioxide or hafnium dioxide disposed on the second dielectric layer. The second dielectric layer provides a homogenous surface on which the high K dielectric layer is formed. The homogeneous surface enables the high K dielectric material to be deposited uniformly thereover, resulting in a uniform thickness profile.


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