The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Nov. 12, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US);
Rahul N. Manepalli, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/565 (2013.01); H01L 23/3157 (2013.01); H01L 23/481 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/17 (2013.01); H01L 23/3121 (2013.01); H01L 23/562 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract
Disclosed is an embedded multi-die interconnect bridge (EMIB) substrate. The EMIB substrate can comprise an organic substrate, a bridge embedded in the organic substrate and a plurality of routing layers. The plurality of routing layers can be embedded within the bridge. Each routing layer can have a plurality of traces. Each of the plurality of routing layers can have a coefficient of thermal expansion (CTE) that varies from an adjacent routing layer.