The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

May. 06, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Litao Yang, Boise, ID (US);

Srinivas Pulugurtha, Boise, ID (US);

Yunfei Gao, Boise, ID (US);

Sanh D. Tang, Meridian, ID (US);

Haitao Liu, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 21/84 (2006.01); H01L 21/265 (2006.01); H01L 29/78 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 21/845 (2013.01); H01L 21/2656 (2013.01); H01L 27/10805 (2013.01); H01L 29/7827 (2013.01);
Abstract

Some embodiments include an integrated assembly having an array of vertically-extending active regions. Each of the active regions is contained within a four-sided area. Conductive gate material is configured as first conductive structures. Each of the first conductive structures extends along a row of the array. The first conductive structures include segments along three of the four sides of each of the four-sided areas. Second conductive structures are under the active regions and extend along columns of the array. Third conductive structures extend along the rows of the array and are adjacent the fourth sides of the four-sided areas. Storage-elements are coupled with the active regions. Some embodiments include methods of forming integrated assemblies.


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