The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Mar. 16, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Wei Chang Cheng, Taichung, TW;
Chi-Hung Liao, Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B 1/00 (2006.01); G03F 7/16 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/162 (2013.01); B05B 1/005 (2013.01); H01L 21/0273 (2013.01);
Abstract
A method of dispensing a fluid in a semiconductor manufacturing process includes providing a substrate, positioning a nozzle above the substrate, and determining a cross-sectional shape of the nozzle. The method also includes configuring the nozzle to have the determined cross-sectional shape and applying the fluid to the substrate through the nozzle with the determined cross-sectional shape.