The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Nov. 03, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Antonio Vellei, Villach, AT;

Markus Beninger-Bina, Sauerlach, DE;

Matteo Dainese, Munich, DE;

Christian Jaeger, Munich, DE;

Johannes Georg Laven, Taufkirchen, DE;

Alexander Philippou, Munich, DE;

Francisco Javier Santos Rodriguez, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 21/033 (2006.01); H01L 21/225 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 29/10 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 21/0337 (2013.01); H01L 21/2253 (2013.01); H01L 21/26506 (2013.01); H01L 21/324 (2013.01); H01L 29/0615 (2013.01); H01L 29/0619 (2013.01); H01L 29/0623 (2013.01); H01L 29/0649 (2013.01); H01L 29/0696 (2013.01); H01L 29/1095 (2013.01); H01L 29/407 (2013.01); H01L 29/41708 (2013.01); H01L 29/4236 (2013.01); H01L 29/66348 (2013.01); H01L 29/7396 (2013.01); H01L 29/4238 (2013.01);
Abstract

A method of processing a power semiconductor device includes: providing a semiconductor body with a drift region of a first conductivity type; forming a plurality of trenches extending into the semiconductor body along a vertical direction and arranged adjacent to each other along a first lateral direction; providing a mask arrangement at the semiconductor body, the mask arrangement having a lateral structure according to which some of the trenches are exposed and at least one of the trenches is covered by the mask arrangement along the first lateral direction; forming, below bottoms of the exposed trenches, a plurality of doping regions of a second conductivity type complementary to the first conductivity type; removing the mask arrangement; and extending the plurality of doping regions in parallel to the first lateral direction such that the plurality of doping regions overlap and form a barrier region of the second conductivity type adjacent to the bottoms of the exposed trenches.


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